PhD Studentships at the University of Oxford, Department of Materials -  UK

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Advanced electronic packaging for extreme environments

This project, being supervised by Professor P Grant and Dr C Johnston, seeks to develop new technology so that electronics may operate under these extreme conditions for up to 10 years.

The project forms part of a large DTI funded academic/industry award bringing together specialists in electronic materials, high reliability assembly and a well logging instrumentation manufacturer.

The project will involve the in-house and industrial manufacture, assembly, testing and micro structural examination of novel multi-material combinations, and the use of finite element modeling to predict and understand behavior under extreme environments.

This studentship is funded through the EPSRC under the DTI Technology Programme.

  It provides full fees and maintenance (current stipend is £12,300 per year, tax free for 3 years) for a citizen of the European Union.

Students from elsewhere who can contribute the difference between the Home/EU and Overseas fees are also eligible to apply; for a studentship commencing in Summer 2007 this difference is expected to be £28,145 over three years.

For details on how to apply and other relevant information, please see "How to apply"

Follow the links below for more details and application contacts.

For more information and application materials, see: PhD Studentships at the University of Oxford, Department of Materials - UK

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